RENA

New RENA Diamond Wire Saw

editor, 13 September 2012

RENA offers dedicated diamond wire saw RS 690-DW with SH + E GROUP coolant recycling

Just one year after successful field approval of the wire saw RS 690-2 for slurry based process RENA launches the new RS 690-DW dedicated for diamond wire application. Fixed abrasive cutting process reduces the watering Cost of Ownership and increases the wire saw throughput >15 MW/a*.

With a maximum cutting length of 680 mm combined with an improved wire guide axis distance the RS 690-DW ensures highest wafer quality as well as outstanding yield. The machine is capable to cut a square section of 156 mm into thin wafers with a minimum wire core diameter of 100 µm. An increased coolant liquid's lifetime is reached by using SH + E GROUP coolant recycling system, thus lowering the wafer production costs significantly.

The lately SH+E GROUP integration brought best expertise in water supply as well as water- and chemistry recycling to RENA. This completion enables RENA to offer now for various solar applications combined process and recycling solutions with high cost reduction out of one hand.

*depending on process parameters.

Diamond wire cutting

SH + E GROUP Coolant recycling

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